advanced micro devices aluminium analog devices antimony arsenic arsine atmel atomic layer deposition boron built-in self-test california chemical-mechanical planarization chemical vapor deposition china cleanroom cleanroom suit compound semiconductor copper czochralski process die attachment die preparation dopant dry etching dynamic random access memory electronic design automation electronics electroplating epitaxy europe flip chip freescale semiconductor furnace anneal gate dielectric global warming hydrofluoric acid hydrogen peroxide hynix ingot integrated circuit integrated circuit packaging international technology roadmap for semiconductors ion implantation israel japan korea lithography low-k microfabrication micrometre micron technology microprocessor nxp semiconductors nitric acid phosphine phosphorus photolithography photoresist physical vapor deposition plasma ashing plating stmicroelectronics semiconductor semiconductor equipment and materials international silane silicate glass silicon silicon dioxide silicon on insulator singapore single crystal sony stepper sulfuric acid tsmc taiwan texas texas instruments thermal oxidation toshiba transistor tungsten wafer testing wet etching wire bonding